Bostik Thermogrip H1714 Alternatives
H1714 is a low application temperature hot melt adhesive for case forming and sealing applications. H1714 is a product specifically designed to provide very low application temperatures (250°F to 275°F) while still providing fiber-tearing bonds over a wide temperature range on a variety of substrates.
Top Alternative for Bostik Thermogrip H1714
#1 Alternative to Bostik Thermogrip H1714
Infinity Bond E2100 Low Temperature Bulk Hot Melt
Bulk Hot Melt from Infinity Bond
Infinity Bond E2100 is a formulated low temperature applied hot melt adhesive that is specially formulated for packaging applications. Infinity Bond E2100 features an aggressive hot tack, excellent adhesion, and excellent machining properties.
Compare Bostik Thermogrip H1714 Alternatives
These 2 products share similar properties and features. They are often used for the same applications.
|Bulk Hot Melt
|Bulk Hot Melt
|Hot Melt Type
|250 - 300°F
|162°F (+/- 2.0)
|850 cP @ 275°F
|850 cps (+/- 170 cps)
These values are approximate. Manufacturers often use different parameters for determining adhesive properties. Refer to manufacturer data sheets for detailed specifications. If you have questions, don't hesitate to contact us.
Questions About Alternatives for Bostik Thermogrip H1714?
Our adhesive specialists can help with any questions about Bostik Thermogrip H1714, including helping you find the best alternative for Bostik Thermogrip H1714 based on the specifics of your adhesive application. We've tested hundreds (probably thousands) of adhesive products and use our experience to advise companies of all types and sizes.
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