Bostik Thermogrip

Bostik Thermogrip H1714 Alternatives

H1714 is a low application temperature hot melt adhesive for case forming and sealing applications. H1714 is a product specifically designed to provide very low application temperatures (250°F to 275°F) while still providing fiber-tearing bonds over a wide temperature range on a variety of substrates.

Compare Bostik Thermogrip H1714 Alternatives

These 2 products share similar properties and features. They are often used for the same applications.

Bostik Thermogrip
Bostik Thermogrip H1714 Hot Melt Adhesive
Infinity Bond E2100 Low Temperature Bulk Hot Melt
Infinity Bond E2100 Low Temperature Bulk Hot Melt
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Price $$$$ $$$$
Type Bulk Hot Melt Bulk Hot Melt
Brand Bostik Infinity Bond
Hot Melt Type --
Application Temperature 250 - 300°F250°- 300°F
Softening Point 164°F162°F (+/- 2.0)
Open Time --
Viscosity 850 cP @ 275°F850 cps (+/- 170 cps)
Color -Amber
Size BulkBulk

These values are approximate. Manufacturers often use different parameters for determining adhesive properties. Refer to manufacturer data sheets for detailed specifications. If you have questions, don't hesitate to contact us.

Questions About Alternatives for Bostik Thermogrip H1714?

Our adhesive specialists can help with any questions about Bostik Thermogrip H1714, including helping you find the best alternative for Bostik Thermogrip H1714 based on the specifics of your adhesive application. We've tested hundreds (probably thousands) of adhesive products and use our experience to advise companies of all types and sizes.

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