Cold Resistant Polyamide Hot Melt - TEC Bond 7784

Power Adhesives TEC Bond 7784 Hot Melt Overview

Power Adhesives TEC Bond 7784 is a temperature resistant general purpose polyamide hot melt offering a medium open time.  It bonds to a wide variety of surfaces and substrates and can be used when extreme cold or heat are a factor. This Polyamide from Power Adhesive tolerates extremely low temperatures, please check out the specifications tab for more details.

Why Buy form Hotmelt.com

Hotmelt.com carries the full Power Adhesives line of TEC Bond hot melt glue sticks and bulk hot melt products.  Please contact us if you have any questions about this glue stick or would like a quote on volume pricing. 

Power Adhesives TEC Bond 7784 Glue Stick Per Carton

• 11 lbs of glue stick size 1/2" x 10" is approximately 198 glue sticks
• 11 lbs of glue stick size 5/8" x 10" is approximately 119 glue sticks
• 22 lbs of glue slug size 1 3/4" x 1 3/4" is approximately 176 glue slugs

Specifications

• Suggested application temperature: 380-420ºF
• Brookfield viscosity (POW-12-VISC) spindle 27: 6000cps @ 350ºF
• Ring & ball softening point (ASTM E28): 275ºF
• Heat resistance (BS5350 Part H3): 220ºF
• Open time: Long
• Low temperature flexibility (tg): -76ºF

Resources

• Contact us for TEC Bond 7784 TDS

• TEC Bond 7784 SDS