TEC 213 General Assembly Hot Melt Glue Sticks

Power Adhesives TEC 213 Hot Melt Overview

Power Adhesives TEC Bond 213 is a clear general purpose, low cost hot melt that can be used in bonding a number of different materials like hard and soft woods, ceramics, rigid PVC and polystyrene.  

This hot melt glue is also excellent when used on porous surfaces like foam and fabric.  The TEC Bond 213 is available in a number of hot melt sticks sizes including 1/2", 3/4" and 1 3/4" hot melt slugs.

Why Buy from Hotmelt.com

Hotmelt.com carries the full line of Power Adhesives TEC Bond hot melt glue sticks and bulk adhesives, contact us with any questions or to request volume pricing. 

Power Adhesives TEC 213 Glue Sticks Per Carton

• 11 lbs of glue stick size 1/2" x 12" is approximately 165 glue sticks
• 11 lbs of glue stick size 5/8" x 12" is approximately 99 glue sticks
• 22 lbs of glue slug size 1 3/4" x 1 3/4" is approximately 176 glue slugs

Specifications

• Suggested application temperature: 380ºF
• Brookfield viscosity (POW-12-VISC) spindle 27: 6000cps @ 350ºF
• Ring & ball softening point (ASTM E28): 195ºF
• Heat resistance (BS5350 Part H3): 165ºF
• Open time: Long
• Low temperature flexibility (tg): 5ºF

Resources

• TEC Bond 213 TDS

• TEC Bond 213 SDS