Foundrytec 501 Low Viscosity Content Sand Core Hot Melt Glue Sticks

Power Adhesives Foundrytec 501 Low Viscosity Foundry Adhesive Glue Sticks

Foundrytec 501 glue sticks are a pale-amber hot melt adhesive designed for bonding sand cores in the foundry industry, helping create very close bonds with a minimum gap between cores. This formulation supports cleaner application by helping prevent stringing and improving overall adhesive applicator output.

Engineered as 1/2" hot melt glue sticks for sand core work, these hot glue sticks use a synthetic polymer based hotmelt chemistry and are intended to reduce the risk of deformations in the finished product by facilitating close core-to-core bonding.

Foundrytec 501 Features & Benefits

• Low Viscosity Bonding: Helps facilitate very close bonds between sand cores with a minimum gap.
• Reduced Stringing: Helps prevent stringing from the applicator nozzle for cleaner application.
• Improved Applicator Output: Supports improved adhesive applicator output during foundry workflows.
• Deformation Risk Reduction: Designed to reduce the risk of deformations in the finished product.
• FDA Compliance: Meets FDA 175.105 for indirect food contact.

Glue Sticks Per Carton

• 11 lbs of 1/2" x 12" glue sticks is approximately 165 glue sticks

Specifications

• Series: Foundrytec 501
• Categories: Industrial & Manufacturing - Foundry Industry
• Compatible Substrates: Sand Cores
• Chemistry: Synthetic Polymer Based Hotmelt
• Size: 1/2" (12mm) Sticks
• Color: Pale Amber
• Application Temperature: 383°F (195°C)
• Softening Point: 221°F (105°C)
• Low Temperature: 32°F (0°C)
• Open Time: 10 Seconds
• Viscosity: 1,200 cps @ 356°F (180°C)
• Heat Resistance: 158°F (70°C)
• Molten Tack: Medium
• Certifications: FDA 175.105 for Indirect Food Contact

Applications

• Sand Core Assembly
• Core Repair
• Core Box Sealing