Technomelt PA 673 N for Electronic Encapsulation and Strain Relief Applications
Henkel Technomelt PA 673 N is an amber polyamide hot melt adhesive engineered for low pressure molding of electronic components. Its low viscosity allows sensitive assemblies to be encapsulated with minimal mechanical stress during processing. Once molded, it forms a durable protective barrier with reliable performance across demanding temperature environments. With a UL 94 V2 flame rating and balanced mechanical properties, it is well suited for potting modules, overmolding sensors, and creating strain relief on wiring.
Key Advantages of PA 673 N Low Pressure Molding Adhesive
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UL 94 V2 Flame Rating: Supports electronic assemblies requiring recognized flammability performance.
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Low Viscosity Flow Profile: Promotes complete mold fill while minimizing stress on delicate components.
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Wide Temperature Reliability: Maintains performance across both low and elevated temperature environments.
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Durable Mechanical Performance: Combines strength and elongation to provide long-lasting encapsulation and strain relief.
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Moisture-Resistant Protection: Forms a resilient barrier against humidity, vibration, and environmental exposure.
Technical Specifications
- Series: Technomelt PA 673 N
- Type: Hot Melt Adhesive
- Application: Molding
- Chemistry: Polyamide
- Components: One-Component
- Cure: Physical Setting
- Color: Amber
- Application Temperature: 410 – 464°F (210 – 240°C)
- Operating Temperature Range: -40 – 284°F (-40 – 140°C)
- Softening Point: 360 – 378°F (182 – 192°C)
- Melting Viscosity:
- 2,800 – 4,000 cps @ 410°F (210°C)
- 2,500 cps @ 428°F (220°C)
- 1,800 cps @ 446°F (230°C)
- Specific Gravity: 0.98 g/cm³ @ 73.4°F (23°C)
- Shore A Hardness: 90
- Yield Strength: 710 psi (4.9 N/mm²)
- Break Strength: 800 psi (5.5 N/mm²)
- E-Modulus: 9,400 psi (65 N/mm²)
- Elongation: 400%
- Temperature Creep Resistance: 320°F (160°C)
- Low Temperature Flexibility: -40°F (-40°C)
- Glass Transition (Tg): -49°F (-45°C)
- Approvals: Flame Rating UL 94 V2