Technomelt PA 638 Black for Low Pressure Molding and Electronics Encapsulation
Technomelt PA 638 Black is a polyamide hot melt adhesive engineered for low pressure molding and electronics encapsulation. UL 94 V-0 rated and designed to perform from -40°F to 266°F (-40°C to 130°C), it provides reliable protection in demanding electrical and industrial environments. The material forms a durable yet flexible barrier that helps protect sensitive components from vibration, impact, and environmental exposure while enabling efficient, cure-free processing.
Key Advantages of PA 638 Black for Low Pressure Molding
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UL 94 V-0 Flame Rating: Supports safety compliance requirements in electronic and electrical assemblies.
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Wide Operating Temperature Range: Performs reliably from -40°F to 266°F (-40°C to 130°C) in demanding industrial environments.
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Durable Yet Flexible Protection: Forms a resilient encapsulant that helps absorb vibration and mechanical stress without cracking.
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Optimized for Low Pressure Molding: Low-viscosity processing helps protect delicate components during encapsulation.
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Cure-Free Thermoplastic Processing: Solidifies quickly after molding to streamline production.
Specifications
- Series: Technomelt PA 638 Black
- Type: Hot Melt Adhesive
- Application: Molding
- Chemistry: Polyamide
- Components: One-Component
- Cure: Physical Setting
- Color: Black
- Application Temperature: 392 – 464°F (200 – 240°C)
- Operating Temperature Range: -40 – 266°F (-40 – 130°C)
- Softening Point: 338 – 356°F (170 – 180°C)
- Melting Viscosity:
- 5,000 cps @ 392°F (200°C)
- 2,800 – 4,000 cps @ 410°F (210°C)
- 2,900 cps @ 428°F (220°C)
- 2,300 cps @ 446°F (230°C)
- Density: 0.98 g/cm³ @ 68°F (20°C)
- Shore A Hardness: 90
- Yield Strength: 652 psi (4.5 N/mm²)
- Break Strength: 754 psi (5.2 N/mm²)
- Elongation: 300%
- Temperature Creep Resistance: 311°F (155°C)
- Low Temperature Flexibility: -22°F (-30°C)
- Glass Transition (Tg): -32.8°F (-36°C)
- Approvals: Flame Rating UL 94 V-0
- Shelf Life: 24 Months (when properly stored)