Technomelt PA 652 N Thermoplastic for Flame-Rated Molding and Cold-Temperature Flexibility
Technomelt PA 652 N is an amber, UL 94 V-0 rated polyamide hot melt adhesive engineered for low pressure molding and encapsulation applications. Its low viscosity supports reduced processing pressure, helping protect fragile electronic components during molding. The material delivers excellent adhesion and outstanding cold-temperature flexibility down to -58°F (-50°C), making it well suited for demanding assemblies. With performance across a -40°F to 212°F (-40°C to 100°C) operating range, it provides dependable protection in challenging environments.
Flame-Rated Low Pressure Molding Benefits of PA 652 N
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UL 94 V-0 Flame Rating: Tested to UL 94 V-0 to support applications requiring flame-retardant performance.
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Excellent Cold-Temperature Flexibility: Maintains flexibility down to -58°F (-50°C), reducing the risk of cracking in low-temperature environments.
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High Adhesion Performance: Bonds effectively to a variety of substrates for secure encapsulation and assembly.
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Low Viscosity Processing: Enables low pressure molding to help protect delicate components during encapsulation.
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Balanced Thermal Stability: Operates reliably from -40°F to 212°F (-40°C to 100°C) across demanding conditions.
Specifications
- Series: Technomelt PA 652 N
- Type: Hot Melt Adhesive
- Application: Molding
- Chemistry: Polyamide
- Components: One-Component
- Cure: Physical Setting
- Color: Amber
- Operating Temperature Range: -40 – 212°F (-40 – 100°C)
- Softening Point: 302 – 329°F (150 – 165°C)
- Melting Viscosity:
- 9,500 cps @ 356°F (180°C)
- 7,000 cps @ 374°F (190°C)
- 5,400 cps @ 392°F (200°C)
- 4,000 cps @ 410°F (210°C)
- Density: 0.98 g/cm³ @ 68°F (20°C)
- Shore A Hardness: 77
- Yield Strength: 377 psi (2.6 N/mm²)
- Break Strength: 392 psi (2.7 N/mm²)
- Elongation: 400%
- Temperature Creep Resistance: 257°F (125°C)
- Low Temperature Flexibility: -58°F (-50°C)
- Glass Transition (Tg): -49°F (-45°C)
- Approvals: Flame Rating UL 94 V-0