Henkel Technomelt PA 6240 (e) Highly Flexible Polyamide Hot Melt Adhesive

Technomelt PA 6240 (e) for Electronic Encapsulation and Molding

Technomelt PA 6240 (e) is an amber polyamide hot melt adhesive engineered for molding compound and electronic encapsulation applications. Its high elongation and flexible profile make it well suited for protecting components subject to vibration or movement. The material adheres effectively to a variety of substrates, including metals and ABS, supporting versatile assembly designs. Designed for consistent thermoplastic processing, it delivers reliable performance in low pressure molding environments.

Features of PA 6240 Polyamide Molding Adhesive

• Highly Flexible Formulation: Engineered to absorb vibration and movement for durable electronic encapsulation.
• Strong Multi-Substrate Adhesion: Bonds effectively to metals, ABS, and a variety of common assembly materials.
• Consistent Processing Characteristics: Supports reliable mold fill and uniform encapsulation in low pressure molding systems.
• Resilient Mechanical Profile: Combines flexibility with structural stability for long-term component protection.
• Extended Working Time: Allows precise component positioning before the material solidifies.

Technical Specifications

• Series: Technomelt PA 6240 (e)
• Type: Hot Melt Adhesive
• Application: Molding
• Chemistry: Polyamide
• Components: One-Component
• Cure: Physical Setting
• Color: Amber
• Application Temperature: 437 – 464°F (225 – 240°C)
• Softening Point: 286°F (141°C)
• Melting Viscosity: 7,000 cps @ 437°F (225°C)
• Shore A Hardness: 72
• Open Time: 50 Seconds
• Yield Strength: 340 psi (2.3 N/mm²)
• Elongation: 890%
• Temperature Creep Resistance: 248°F (120°C)
• Shelf Life: 12 Months (when properly stored)