Henkel Technomelt PA 657 Black Encapsulation Hot Melt Overview
Henkel Technomelt PA 657 is a high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at a low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage. This material produces no toxic fumes and provides a good balance of low and high temperature performance.
Features and Benefits of Technomelt PA 657
- Easy moldability
- Good adhesion to a variety of substrates
- Cold temperature flexibility
- Excellent moisture resistance
|Polyamide Hot Melt
|Softening point, °C
|150 to 165
|180 to 230 °C
|UL 94 V-0
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