Henkel Technomelt PA 2302 Black High Strength Polyamide Hot Melt Adhesive

Technomelt PA 2302 Black for High Performance Molding and Encapsulation

Technomelt PA 2302 Black is a high-strength polyamide hot melt adhesive engineered for demanding molding and encapsulation applications. Its low viscosity supports efficient processing while helping protect fragile components during molding. Once cooled, it forms a rigid, durable barrier that shields electronics from mechanical stress and environmental exposure. With temperature creep resistance up to 374°F (190°C), it delivers reliable performance in elevated heat environments.

High Strength Performance of Technomelt PA 2302 Black

• High Mechanical Strength: Tensile strength up to 2,901 psi (20 N/mm²) provides durable structural support after molding.
• Rigid Shore D Hardness: Shore D 53 delivers a tough, impact-resistant encapsulant for demanding environments.
• High Temperature Resistance: Temperature creep resistance up to 374°F (190°C) supports performance in elevated heat conditions.
• Low Viscosity Processing: Enables efficient mold fill while helping protect delicate electronic components during encapsulation.
• Reliable Environmental Barrier: Forms a durable protective layer between electronics and external mechanical or environmental stressors.

Technical Specifications

• Series: Technomelt PA 2302 Black
• Type: Hot Melt Adhesive
• Application: Molding
• Chemistry: Polyamide
• Components: One-Component
• Cure: Physical Setting
• Color: Black
• Application Temperature: 428 – 464°F (220 – 240°C)
• Softening Point: 392 – 410°F (200 – 210°C)
• Melting Viscosity: 3,500 – 6,000 cps @ 464°F (240°C)
• Shore D Hardness: 53
• Yield Strength: 2,176 psi (15 N/mm²)
• Break Strength: 2,901 psi (20 N/mm²)
• Elongation: 500%
• Temperature Creep Resistance: 374°F (190°C)
• Low Temperature Flexibility: 5°F (-15°C)
• Shelf Life: 24 Months (when properly stored)