Biodegradable Low Temp Metallocene Hot Melt Adhesive for Automated Packaging

Power Adhesives Tecbond 355B Biodegradable Metallocene

Power Adhesives Tecbond 355B is a biodegradable, metallocene-based hot melt adhesive designed for cold storage and automated packaging applications.

Engineered for high-speed performance and exceptional cold-temperature reliability down to -22°F (-30°C), it delivers clean-running performance, low char, and excellent thermal stability during long production runs.

Biodegradable Metallocene Glue

Tecbond 355B is 45% bio-based and non-toxic. It offers a sustainable alternative to standard bulk hot melt. It has been tested to meet the following certifications:

• ASTM D6400
• ASTM D6866
• ASTM D6954
• EN13432

Biodegradable under industrial composting conditions, Tecbond 355B pellets begin to degrade when exposed to oxygen, UV light, and heat. After the long-chain polymers are broken down, microorganisms consume the remaining material without leaving behind microplastics or harmful byproducts.

To maintain quality and prevent premature degradation, store the biodegradable metallocene adhesive in its original packaging, away from direct sunlight, and at temperatures below 86°F (30°C).

Common Applications

Tecbond 355B can bond challenging substrates such as lacquered and varnished boards, so it is a dependable choice for various related applications. Some of the most common applications for this biodegradable metallocene hot melt glue include:

• Case and Carton Sealing: Fast, secure bonds for high-speed production lines
• Tray Assembly: Maintains strength with complex folds and coated boards
• Packaging Inserts: Keeps inserts firmly in place during transit
• Point-of-Sale Displays: Delivers strong, clean bonds without affecting presentation quality
• Cold Storage Packaging: Dependable adhesion in environments down to -22°F (-30°C)
• FDA 175.105 Compliant for Indirect Food Contact: Supports demanding food and beverage packaging operations while promoting sustainable practices

Performance Highlights

• Eco-Conscious Degradation: Meets EN13432, ASTM D6954, ASTM D6866, and ASTM D6400 standards, breaking down naturally without producing microplastics
• Metallocene-Based Adhesive: Offers clean-running performance, low char, and exceptional thermal stability during extended production runs
• Cold Temperature Reliability: Maintains strong adhesion in storage environments down to -22°F (-30°C)
• Strong on Difficult Substrates: Bonds reliably to lacquered and varnished boards, as well as other coated packaging materials
• FDA 175.105 Compliant: Safe for indirect food contact applications

Tecbond 355B Product Specifications

• Product Type: Biodegradable Metallocene Hot Melt Adhesive
• End Use Applications: Automated Packaging, Case and Carton Sealing, Tray Assembly, Packaging Inserts, Point-of-Sale Displays
• Substrates: Paper, Cardboard, and Coated Cardboard
• Chemistry: Metallocene-Based Polyolefin (PO)
• Appearance: Off-White
• Physical Shape: Pellets
• Package Size: 44 lb (20 kg) Carton
• Recommended Application Temperature: 320°F–356°F (160°C–180°C)
• Ring and Ball Softening Point (ASTM E28): 234°F (113°C)
• Brookfield Viscosity: 1,000 cps @ 356°F (180°C)
• Heat Resistance (BS5350 Part H3): 185°F (85°C)
• Molten Tack: High
• Open Time: 10 Seconds
• Brittle Point: -4°F (-20°C)
• Certifications:
• ASTM D6400
• EN13432
• ASTM D6866
• ASTM D6954
• FDA 175.105 for Indirect Food Contact
• Shelf Life: 2 Years from Manufacture Date (Store away from sunlight, in original packaging, and in temperatures below 86°F (30°C))