Henkel Technomelt Supra 606 Low Temp Packaging Hot Melt Adhesive

Henkel Technomelt Supra 606 Hot Melt for High-Speed Case and Carton Sealing Overview

Technomelt Supra 606 is a low temperature packaging adhesive offering excellent adhesion to a variety of substrates. It is ideal for high-speed or tankless systems, delivering strong bonds while minimizing char and downtime. This water-white hot melt provides an economical option that maintains reliable performance and stability across a wide range of packaging operations. All ingredients in Technomelt Supra 606 comply with FDA Regulation 21 CFR 175.105 for indirect food contact.

Key Features and Benefits of Technomelt Supra 606

• High Thermal Stability: Maintains performance for up to 500 hours, reducing char formation and equipment maintenance.
• Low Application Temperature: Combines LowMelt® and conventional 350°F technology for safer, energy-efficient operation.
• Excellent Adhesion: Bonds effectively to various substrates, providing strong hold and reduced adhesive consumption.
• Fast Set with Good Open Time: Performs well across different equipment speeds and packaging line configurations.
• Anti-Char Additives: Prevents paper fiber charring and buildup, minimizing downtime and improving production efficiency.
• FDA Compliant: Meets 21 CFR 175.105 requirements for indirect food contact applications.

Specifications

• Model: Technomelt® Supra 606
• Type of Adhesive: Hot Melt Adhesive
• Applications: High-speed case and carton sealing, packaging operations, and tankless systems
• Compatible Substrates: Paper, board, and coated packaging materials
• Form: Pellets
• Color: White to Off-White
• Application Temperature: 275°F–325°F (135°C–163°C)
• Softening Point: 205°F ±10°F (96°C ±6°C)
• Viscosity:
• 2,200 cps @ 275°F (135°C)
• 1,400 cps @ 300°F (149°C)
• 900 cps @ 325°F (163°C)
• Application Methods: Suitable for conventional and tankless hot melt application systems