InfinityPACK Plus E1370 Packaging Hot Melt for Difficult Substrates
InfinityPACK Plus E1370 Packaging Hot Melt for Difficult Substrates Overview
InfinityPACK Plus is a high-performance packaging hot melt adhesive. InfinityPACK Plus is excellent for tray forming and case/carton sealing applications. Infinity Bond E1370 is very heat stable with clean machining properties. E1370 also offers excellent high and low temperature bond performance.
Online pricing is for a 25 LB sample pack and there are discounts at higher volumes. Hotmelt.com can also offer free samples and help with line trials for qualifying applications. Contact us with questions about InfinityPACK Plus or any bulk hot melt for your packaging application.
Common Applications
- Difficult Substrates
- Coated Stock
- Coated Substrates
- Tray Forming
- Case or Carton Sealing
Applying InfinityPACK Plus Hot Melt
Infinity InfinityPACK Plus can be applied with manual or automated bulk dispensing equipment. InfinityPACK Plus offers excellent heat stability and a low viscosity making it perfect for packaging.
InfinityPACK Plus E1370 Packaging Hot Melt for Difficult Substrates Specs
- Application Temperature: 325-360F
- Viscosity @ 350F: 1200 cps
- Heat Stability @ 350F: Excellent in 96 Hours
- Set Speed: Fast
- Softening Point: 230F
- Product Form: 1/4" Pellets
InfinityPACK Plus E1370 Packaging Hot Melt for Difficult Substrates Resources
- InfinityPACK Plus Technical Data Sheet (TDS)
- InfinityPACK Plus Safety Data Sheet (SDS) - Contact us