- Type: Bulk Hot Melt
- Brand: Infinity Bond
- Hot Melt Type: APAO
- Set Speed: Short
- Adhesive Size: Bulk Glue
- Color: White
- Bonds: Cardboard, Coated Stock
- Properties: Low Cost Packaging, Food Safe
- Application: Packaging
Infinity Bond ProPACK M4000 APAO Hot Melt Adhesive for Difficult Packaging Substrates
Infinity Bond ProPACK M4000 is a high-performance APAO hot melt adhesive engineered for end-of-line packaging and product assembly applications. This hot melt offers exceptional adhesion to coated and hard-to-bond substrates, including plastics, paperboard, and corrugated fiberboard. IM-M4000 combines the performance of premium metallocene adhesives with the economy of traditional EVAs—delivering superior heat and cold resistance, clean melting, and consistent bonding in demanding environments.
Key Advantages IM-M4000 Packaging Hot Melt
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Superior Substrate Compatibility: Bonds coated, uncoated, and hard-to-bond packaging materials such as plastics, paperboard, and corrugated fiberboard.
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Enhanced Thermal Resistance: Maintains strong adhesion under both high-heat and cold-storage conditions.
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Clean-Melting Performance: Reduces char formation and equipment maintenance, ensuring smoother, more reliable operation.
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Cost-Effective Formulation: Delivers premium APAO performance at a lower cost than most metallocene or EVA hot melts.
- Reliable Packaging Integrity: Provides consistent bonding strength for end-of-line sealing, case and carton closing, and product assembly.
Specifications
- Series: ProPACK
- Model: IM-M4000
- Type: Hot Melt Adhesive
- Applications: End of Line Packaging, Product Assembly
- Compatible Substrates: Difficult substrates, plastics, cardboard, corrugated fiberboard, containerboard, paperboard, boxboard, chipboard, coated and uncoated stock
- Chemistry: Modified Butene-1 Copolymer APAO
- Form: Pellets
- Color: White
- Application Temperature: 350°F - 375°F (177°C - 191°C)
- Melt Viscosity: 850 cps @ 375° (190°C)
- Softening Point: 275°F (135°C)
- Certifications: Conforms to FDA regulation 21 CFR 175.105
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