Henkel Technomelt PA 6797 N Multi-Substrate Polyamide Hot Melt Adhesive

Technomelt PA 6797 N for General Assembly and PVC Bonding Applications

Henkel Technomelt PA 6797 N is an amber polyamide hot melt adhesive designed for general assembly applications. Its low-viscosity formulation supports efficient processing while delivering strong adhesion to substrates such as PVC and PA6.6. Once applied, it solidifies into a resilient bond with balanced mechanical performance. This grade is well suited for assemblies requiring dependable adhesion without introducing excessive mechanical stress.

Technical Advantages of PA 6797 N for General Assembly

• Multi-Substrate Adhesion: Bonds effectively to PVC, PA6.6, and a wide range of common assembly materials.
• Low Viscosity Processing: Supports consistent application and efficient production workflows.
• Resilient Bond Performance: Provides flexibility and durability for dependable long-term assembly integrity.
• UL 94 V2 Flame Rating: Supports assemblies requiring recognized flammability performance.
• Stable Service Performance: Maintains reliability across varying operating conditions without mechanical stress.

Specifications

• Series: Technomelt PA 6797 N
• Type: Hot Melt Adhesive
• Application: General Assembly
• Chemistry: Polyamide
• Components: One-Component
• Cure: Physical Setting
• Color: Amber
• Application Temperature: 356 – 428°F (180 – 220°C)
• Operating Temperature Range: -4 – 140°F (-20 – 60°C)
• Softening Point: 239 – 257°F (115 – 125°C)
• Melting Viscosity:
• 12,500 cps @ 320°F (160°C)
• 3,000 – 4,000 cps @ 374°F (190°C)
• 2,500 cps @ 410°F (210°C)
• Specific Gravity: 0.98 g/cm³ @ 73.4°F (23°C)
• Shore A Hardness: 60
• Yield Strength: 170 psi (1.2 N/mm²)
• Break Strength: 120 psi (0.8 N/mm²)
• E-Modulus: 1,230 psi (8.5 N/mm²)
• Elongation: 300%
• Temperature Creep Resistance: 185°F (85°C)
• Low Temperature Flexibility: -4°F (-20°C)
• Glass Transition (Tg): -0.4°F (-18°C)
• Approvals: Flame Rating UL 94 V2