Henkel Technomelt PA 6773 Grey Thermally Conductive Polyamide Hot Melt Adhesive

Technomelt PA 6773 Grey for Enhanced Heat Transfer in Molding Applications

Henkel Technomelt PA 6773 Grey is a thermally conductive polyamide hot melt developed for molding and specialty assembly applications where improved heat transfer is required. With elevated thermal conductivity of 0.8 W/(m·K), it supports efficient dissipation of heat within encapsulated components. Its higher density and rigid mechanical profile provide dimensional stability in demanding environments. This grade is suited for low pressure molding processes that require controlled flow and structural integrity.

Key Features and Benefits of PA 6773 Grey Polyamide

• Improved Heat Dissipation: Formulated to transfer heat more effectively within molded and encapsulated components.
• Structural Rigidity: Provides dimensional stability in assemblies where a firmer material profile is required.
• Durable Molded Performance: Supports long-term reliability in thermally demanding environments.
• Controlled Flexibility: Engineered with limited elongation for applications that prioritize stability over softness.
• Low Pressure Molding Compatible: Designed for consistent processing in specialized molding systems.

Technical Specifications

• Series: Technomelt PA 6773 Grey
• Type: Hot Melt Adhesive
• Application: Molding
• Chemistry: Polyamide
• Components: One-Component
• Cure: Physical Setting
• Color: Grey
• Application Temperature: 392 – 410°F (200 – 210°C)
• Softening Point: 320°F (160°C)
• Melting Viscosity: 7,000 cps @ 410°F (210°C)
• Density: 1.4 g/cm³ @ 68°F (20°C)
• Shore D Hardness: 39
• Yield Strength: 870 psi (6.0 N/mm²)
• Break Strength: 725 psi (5.0 N/mm²)
• Temperature Creep Resistance: 275°F (135°C)
• Glass Transition (Tg): -13°F (-25°C)
• Thermal Conductivity: 0.8 W/(m K)
• Shelf Life: 12 Months (when properly stored)