Henkel Technomelt PA 6771 N Black UV Stable Polyamide Hot Melt Adhesive

Technomelt PA 6771 Black for Low Pressure Molding and Outdoor Electronics Encapsulation

Technomelt PA 6771 Black is a UV-stable polyamide hot melt adhesive engineered for low pressure molding and outdoor electronics encapsulation. Its low viscosity enables reduced processing pressure, helping protect delicate components during molding. Once cooled, it forms a resilient barrier that provides strong heat stability, moisture resistance, and environmental protection. Designed for outdoor applications, it delivers durable performance across a wide range of substrates, including FR4, metals, and engineering plastics.

Performance Advantages of Technomelt PA 6771 Black

• UV Stability for Outdoor Use: Formulated to maintain performance and appearance when exposed to sunlight and UV radiation.
• Moisture Resistance: Forms a protective barrier that helps shield electronics from humidity and environmental exposure.
• Low Viscosity Processing: Supports low pressure molding to help protect fragile components during encapsulation.
• Heat Stability: Delivers reliable performance in elevated temperature environments.
• Versatile Substrate Adhesion: Bonds effectively to FR4, metals, and engineering plastics such as ABS and PC.

Specifications

• Series: Technomelt PA 6771 N Black
• Type: Hot Melt Adhesive
• Application: Molding
• Chemistry: Polyamide
• Components: One-Component
• Cure: Physical Setting
• Color: Black
• Application Temperature: 410 – 464°F (210 – 240°C)
• Softening Point: 370°F (188°C)
• Melting Viscosity: 8,475 cps @ 410°F (210°C)
• Specific Gravity: 1.01 g/cm³ @ 68°F (20°C)
• Shore D Hardness: 29
• Yield Strength: 667 psi (4.6 N/mm²)
• Break Strength: 435 psi (6.4 N/mm²)
• Elongation: 500%
• Low Temperature Flexibility: -49°F (-45°C)
• Glass Transition (Tg): -67°F (-55°C)