Henkel Technomelt PA 668 N Transparent Polyamide Hot Melt Adhesive

Technomelt PA 668 N for Transparent Electronic Encapsulation and Molding

Henkel Technomelt PA 668 N is a clear polyamide hot melt adhesive designed for low pressure molding and encapsulation applications requiring transparency. This one-component thermoplastic material provides strong mechanical performance, high Shore A hardness, and reliable environmental protection for electronic assemblies. It is well suited for applications where visual inspection of encapsulated components is necessary.

Technical Advantages of PA 668 N for Optical Encapsulation

• Optical Transparency: Clear formulation allows visual inspection of encapsulated components without obstruction.
• Low Pressure Process Compatibility: Designed for low pressure molding to protect sensitive electronics during encapsulation.
• High Shore A Hardness (90): Provides structural stability and durable protective coverage.
• Strong Mechanical Strength: 5.5 N/mm² yield strength and 8.5 N/mm² break strength support long-term reliability.
• High Elongation (600%): Maintains flexibility while resisting cracking under mechanical stress.

Technical Specifications

• Series: Technomelt PA 668 N
• Type: Hot Melt Adhesive
• Application: Molding - Encapsulation
• Chemistry: Polyamide
• Components: One-Component
• Cure: Physical Setting
• Color: Clear
• Application Temperature: 356 – 446°F (180 – 230°C)
• Operating Temperature Range: -13 – 221°F (-25 – 105°C)
• Softening Point: 311°F (155°C)
• Melting Viscosity: 5,500 cps @ 437°F (225°C)
• Density: 0.98 g/cm³
• Shore A Hardness: 90
• Yield Strength: 798 psi (5.5 N/mm²)
• Break Strength: 1,233 psi (8.5 N/mm²)
• Elongation: 600%
• Low Temperature Flexibility: -13°F (-25°C)
• Shelf Life: 24 Months (when properly stored)