Technomelt PA 658 Black for Low Pressure Molding and Electronics Encapsulation
Technomelt PA 658 Black is a high-performance polyamide hot melt adhesive designed for low pressure molding and electronics encapsulation. Its low viscosity enables processing at reduced molding pressures, helping protect delicate components during encapsulation. The material delivers excellent adhesion to a wide range of substrates while maintaining strong cold-temperature flexibility down to -58°F (-50°C). With a balanced operating range of -40°F to 212°F (-40°C to 100°C), it provides durable protection in demanding industrial environments.
Performance Benefits of Technomelt PA 658 Black Polyamide
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High Adhesion Performance: Bonds effectively to a wide range of substrates, supporting durable encapsulation in demanding applications.
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Excellent Cold-Temperature Flexibility: Maintains flexibility down to -58°F (-50°C), reducing the risk of cracking in low-temperature environments.
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Low Viscosity for Component Protection: Enables low-pressure processing to help safeguard delicate electronic assemblies during molding.
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Balanced Thermal Performance: Operates reliably from -40°F to 212°F (-40°C to 100°C) across varying environmental conditions.
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Moisture Resistance: Helps maintain adhesion and mechanical performance in humid or moisture-prone environments.
Specifications
- Series: Technomelt PA 658 (e) Black
- Type: Hot Melt Adhesive
- Application: Molding – Encapsulation
- Chemistry: Polyamide
- Components: One-Component
- Cure: Physical Setting
- Color: Black
- Application Temperature: 410 – 446°F (210 – 230°C)
- Operating Temperature Range: -40 – 212°F (-40 – 100°C)
- Softening Point: 302 – 329°F (150 – 165°C)
- Melting Viscosity: 4,000 cps @ 410°F (210°C)
- Specific Gravity: 0.97 g/cm³ @ 68°F (20°C)
- Shore A Hardness: 77
- Tensile Yield: 406 psi (2.8 N/mm²)
- Tensile Break: 464 psi (3.2 N/mm²)
- Modulus (2%): 3,916 psi (27 N/mm²)
- Elongation: 400%
- Low Temperature Flexibility: -58°F (-50°C)
- Shelf Life: 12 Months (when properly stored)