Henkel Technomelt GA 1214 Long Open Time Bookbinding Hot Melt

Achieve Reliable Bookbinding Results with Technomelt GA 1214 EVA Hot Melt

Henkel Technomelt GA 1214 is a long open time EVA hot melt adhesive engineered for bookbinding and perfect binding applications. It offers excellent adhesion to coated and uncoated paper stocks while maintaining clean machining and reliable thermal stability. With a running temperature range of 300°F–360°F (149°C–182°C), it performs consistently across modern binding lines. This non-PSA formulation also meets FDA 21 CFR 175.105 composition requirements for indirect food contact.

Key Features and Benefits of Technomelt GA 1214

• Long Open Time: Provides extended working time for precise alignment and consistent bonding during bookbinding and perfect binding operations.
• Excellent Adhesion: Bonds effectively to coated and uncoated paper stocks for reliable spine and cover attachment.
• Clean Machining: Maintains smooth operation in roll and nozzle applicators, reducing char and maintenance downtime.
• Thermal Stability: Performs consistently across running temperatures of 300°F–360°F (149°C–182°C) with minimal viscosity drift.
• Non-PSA Formulation: Offers strong bonding without tackiness, ideal for tight backing, tipping, and hinge glue applications.
• FDA Compliant: Meets the composition requirements of FDA 21 CFR 175.105 for indirect food contact adhesives.

Specifications

• Model: Technomelt® GA 1214
• Type of Adhesive: EVA Hot Melt Adhesive
• Applications: Bookbinding, perfect binding, tipping, hinge gluing, and tight backing
• Compatible Substrates: Coated and uncoated paper stocks
• Form: Pellets
• Color: Off-white solid
• Application Temperature: 300°F–360°F (149°C–182°C)
• Softening Point: 167°F (75°C)
• Viscosity:
• 1,850 cps @ 350°F (177°C)
• 2,900 cps @ 325°F (163°C)
• 4,500 cps @ 300°F (149°C)
• 7,500 cps @ 275°F (135°C)
• 13,400 cps @ 250°F (121°C)
• Density: Approx. 8.1 lbs/gallon
• Application Methods: Compatible with all hot melt roll and nozzle applicators
• FDA Status: Meets composition requirements of 21 CFR 175.105 “Adhesives”