Bostik PES 3320 Copolyester Hot Melt Glue for Low-Temperature Technical Laminations
Bostik PES 3320 is a moderately low melting thermoplastic copolyester adhesive designed for technical fabric laminations and composite bonding. It forms strong bonds to a wide variety of substrates including textiles, fiberboard, metal, PVC, and PU foam. Supplied in both powder and pellet form, PES 3320 is well-suited for applications requiring flexible adhesion at lower processing temperatures.
Benefits of Bostik PES 3320 Technical Lamination Glue
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Low-Temperature Fusing: Activates at glue-line temperatures between 239–284°F (115–140°C), ideal for heat-sensitive laminations.
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Good Adhesion to Multiple Substrates: Bonds well to PU foam, PVC, glass fiber, fiberboard, and metal.
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Moderate Flow Behavior: Melt viscosity of 500,000 cps allows controlled coating and spreading during lamination.
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Flexible Mechanical Properties: Shore D56 hardness supports use in composite and technical fabric systems.
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Available in Versatile Formats: Offered in powder and pellet forms, with particle sizes for paste dot, powder dot, or scatter coating.
Specifications
- Model: PES 3320
- Chemistry: Thermoplastic Copolyester Adhesive
- Appearance: White Powder or Pellets
- Compatible Substrates: Textiles, fiberboard, metal, PVC, PU foam
- Common Applications: Technical laminations, composite bonding
- Melting Point (DSC): 207–225°F (97–107°C)
- Glass Transition Temperature (Tg): 63°F (17°C)
- Melt Flow Rate: 25 g/10 min @ 320°F (160°C)
- Melt Viscosity: 500,000 cps @ 320°F (160°C)
- Hardness: Shore D56
- Density: 1.29 g/cm³
- Fusing Temperature (Glue-Line Temp): 239–284°F (115–140°C)
- Fusing Pressure: 3–5 N/cm²
- Fusing Time: 10–15 seconds
- Washing Resistance: Up to 122°F (50°C)
- Heat Resistance: Up to 158°F (70°C)
- Dry Cleaning Resistance: Fair
- Storage and Handling: Store in a dry environment below 86°F (30°C)
- Shelf Life: Up to 2 years in original sealed packaging
- Available Particle Sizes:
- Paste Dot: 0–80 µm
- Powder Dot: 80–200 µm
- Scatter Coating: 100–500 µm